Dual-folded-dipole-array in chip package for single-chip 60-GHz radios

This paper presents a dual-folded-dipole array integrated in a thin cavity-down ball grid array chip-scale package for highly-integrated 60-GHz radios. Realized in a low temperature cofired ceramic (LTCC) technology, the package measures 12.5x8x1.265 mm3 and can carry a 60-GHz radio die of current size. The antenna array is designed to cover a 7-GHz bandwidth from 57 to 64 GHz to suit the allocated frequency range. It achieves return loss more than 8 dB, gain 9 ± 2.5dBi and radiation efficiency of better than 90% over the bandwidth, which clearly demonstrates the feasibility of the elegant antenna-array-in-chip-package solution for emerging short-range high-speed 60-GHz wireless personal area network (WPAN) systems [1-5].