Capacitively coupled non-contact probing circuits for membrane-based wafer-level simultaneous testing

Author

Daito, M. ; Nakata, Y. ; Sasaki, Seishi ; Gomyo, H. ; Kusamitsu, H. ; Komoto, Y. ; Iizuka, Kunihiko ; Ikeuchi, Katsushi ; Kim, G.S. ; Takamiya, Makoto ; Sakurai, Takayasu

Author_Institution

Assoc. of Super-Adv. Electron. Technol., Yokohama, Japan

fYear

2010

fDate

7-11 Feb. 2010

Firstpage

144

Lastpage

145

Abstract

A capacitively coupled probing circuit with a de-skewer, a low-pass filter and a weak-feedback receiver realize membrane-based wafer-level simultaneous testing robustly with more than 300 Kpin connections. Both the probe chip and 300 mm DUT-wafer are fabricated in 90 nm and the measured power consumption of RX core is 0.5 mW with BER of 10^-12 at 1 Gb/s.

Keywords

coupled circuits; error statistics; integrated circuit testing; low-pass filters; power consumption; BER; DUT wafer; RX core; bit rate 10 Gbit/s; capacitively coupled probing circuits; de skewer; low pass filter; noncontact probing circuits; power 0.5 mW; power consumption; size 300 mm; size 90 nm; wafer level simultaneous testing; weak feedback receiver; Biomembranes; Bit error rate; Circuit testing; Clocks; Coupling circuits; Electronic equipment testing; Probes; Switches; System testing; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

978-1-4244-6033-5

Type

conf

DOI

10.1109/ISSCC.2010.5434018

Filename

5434018