Title :
System-In-Package (SIP): challenges and opportunities
Author_Institution :
Bell Labs., Lucent Technol., Murray Hill, NJ, USA
Abstract :
In this paper, we propose the concept of System-In-Package (SIP) as a generalization of System-On-Chip (SOC). System-In-Package overcomes formidable integration barriers without compromising individual chip technologies. The goal of SIP is to match or exceed SOC performance with lower cost. SIP technology platform that provides the needed integration is described. Applications include integrating memory with logic and integrating radio frequency ICs with high-quality (high-Q) passive components. SIP technology will unleash the innovations of designers and unlock the full potential of IC technology.
Keywords :
Q-factor; application specific integrated circuits; integrated circuit design; integrated circuit packaging; IC technology; SIP; chip technologies; cost; high-Q passive components; radio frequency ICs; system-in-package; Costs; Electronics industry; Integrated circuit technology; Logic; Packaging; Radio frequency; Random access memory; System-on-a-chip; Technological innovation; Time to market;
Conference_Titel :
Design Automation Conference, 2000. Proceedings of the ASP-DAC 2000. Asia and South Pacific
Conference_Location :
Yokohama, Japan
Print_ISBN :
0-7803-5973-9
DOI :
10.1109/ASPDAC.2000.835095
