DocumentCode :
1889934
Title :
Improved accuracy thermal nanostructure
Author :
Popa, Cosmin
Author_Institution :
Fac. of Electron., Telecommun. & Inf. Technol., Univ. Politeh. of Bucharest, Bucharest, Romania
fYear :
2011
fDate :
27-29 April 2011
Firstpage :
1
Lastpage :
4
Abstract :
A new high precision superior-order curvature-corrected integrated nanostructure will be presented. In order to improve the temperature behavior of the circuit, a double differential structure will be used, implementing the linear and the superior-order curvature corrections. An original CTAT (Complementary To Absolute Temperature) voltage generator will be proposed, using exclusively MOS transistors biased in weak inversion for a low power operation of the integrated nanostructure, having two great advantages: an important reducing of the circuit silicon area and an improved accuracy (matched resistors being replaced by matched MOS active devices). The superior-order curvature-correction will be implemented by taking the difference between two gate-source voltages of subthreshold-operated MOS transistors, biased at drain currents having different temperature dependencies: PTAT (Proportional To Absolute Temperature) and PTAT2. The SPICE simulations confirm the theoretical estimated results, showing a temperature coefficient under 11ppm / K for an extended input range 223K <;T <; 423K and for a supply voltage of 1.8V and a current consumption of about 1μA.
Keywords :
MOS integrated circuits; SPICE; VLSI; curvature measurement; CTAT voltage generator; MOS transistors; accuracy thermal nanostructure; double differential structure; superior-order curvature-corrected integrated nanostructure; temperature behavior; Generators; Logic gates; MOSFETs; Nanoscale devices; SPICE; Temperature dependence; Temperature distribution; Temperature behavior; integrated nanostructures; superior-order curvature-correction technique;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
EUROCON - International Conference on Computer as a Tool (EUROCON), 2011 IEEE
Conference_Location :
Lisbon
Print_ISBN :
978-1-4244-7486-8
Type :
conf
DOI :
10.1109/EUROCON.2011.5929208
Filename :
5929208
Link To Document :
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