Application of in-situ particle monitoring in defect management system under clean manufacturing environment

Author

Chen, Vincent M C ; Chow, Apple Wanyee ; Milor, Linda ; Peng, Yeng-kaung

Author_Institution

Submicron Dev. Center, Adv. Micro Devices Inc., Sunnyvale, CA, USA

fYear

1997

fDate

6-8 Oct 1997

Abstract

In-situ Particle Monitors (ISPM) have been adopted in the industry for optimizing cleaning cycles and detecting equipment abnormalities. However, in advanced manufacturing environments where the equipment is well maintained and where yield-dominating excursions rarely happen, the ISPM signal is usually too weak to use for yield monitoring. This paper details what we did to optimize ISPM sensitivity performance for non-excursion conditions, analyzes the results, and presents an alternative approach for integrating ISPM in defect management systems

Keywords

clean rooms; computerised monitoring; inspection; integrated circuit yield; particle counting; sputter etching; surface cleaning; advanced manufacturing environments; clean manufacturing environment; cleaning cycles optimization; defect management system; equipment abnormalities detection; in-situ particle monitoring; nonexcursion conditions; plasma etch; sensitivity performance; single-wafer etch system; surfscan count; yield monitoring; Cleaning; Environmental management; Etching; Geometry; Manufacturing; Monitoring; Performance analysis; Plasma applications; Pollution measurement; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664502

Filename

664502