The highly integrated frequency converter

Author

Vadstrup, Pierre

Author_Institution

Grundfos A/S, Bjerringbro, Denmark

Volume

1

fYear

1997

fDate

26-29 May 1997

Firstpage

446

Abstract

Integration, by the use of hybrid technology and application specific integrated circuits is a means to reduce cost, increase reliability and to improve performance. Issues like thermal management, mechanical packaging, manufacturing, component choices and testability are some of the ingredients in the integration decision process. The Grundfos X3000 module is an example of an integrated frequency converter module optimized according to the aforementioned issues. Modeling and simulation are necessary in the optimization process and very detailed models have been developed in the Simulink/Matlab environment by the extensive use of finite element tools

Keywords

application specific integrated circuits; circuit analysis computing; circuit optimisation; finite element analysis; frequency convertors; hybrid integrated circuits; integrated circuit modelling; software packages; Grundfos X3000 integrated frequency converter module; Simulink/Matlab environment; application specific integrated circuits; circuit simulation; component choices; computer simulation; cost; finite element tools; hybrid technology; integration decision process; manufacturing; mechanical packaging; optimization process; performance; reliability; testability; thermal management; Application specific integrated circuits; Components, packaging, and manufacturing technology; Costs; Frequency conversion; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Manufacturing processes; Mathematical model; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Drive Systems, 1997. Proceedings., 1997 International Conference on

Print_ISBN

0-7803-3773-5

Type

conf

DOI

10.1109/PEDS.1997.618745

Filename

618745