• DocumentCode
    1890430
  • Title

    Dynamic analysis of impact pinning AL203 ceramic substrates

  • Author

    Campbell, Barrie C. ; Henderson, Donald W. ; Lee, John H C ; Lehman, Lawrence P. ; Pimbley, Walter T.

  • Author_Institution
    IBM Corp., Endicott, NY, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    401
  • Abstract
    Impact pinning is used to stake pins into a ceramic substrate by striking cylindrical pins with a ballistic piston to cold-form a head and a bulge on opposite sides of the substrate. The dynamics and controlling mechanisms of this process are elucidated. The deformation of the pins is the result of the competing mechanisms of simple axial compression and dynamic buckling induced by the applied force. Sinusoidal buckling wave modes are set up initially in each pin, but are relatively unimportant until after the pins fill the holding die cavities. The pins next impinge the substrate through-holes´ walls, and head formation commences. Continued pin buckling causes impingement to become more severe, and the pins capture the substrate. The substrate abruptly accelerates, causing the bulge to form. The development of the bulge stops the motion of the substrate. Head formation is completed. The entire sequence of events takes less than 100 μs (in the case of interest). Quantitative analysis and modeling reveal the details of process evolution. Theoretical calculations were verified experimentally
  • Keywords
    packaging; 100 mus; AL203 ceramic substrates; axial compression; ballistic piston; cold form head and bulge; dynamic analysis; dynamic buckling; impact pinning; model; modeling; pin deformation; process evolution; stake pins into ceramic substrate; Acceleration; Ceramics; Contacts; Copper; Electronic components; Integrated circuit interconnections; Magnetic heads; Pins; Pistons; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122221
  • Filename
    122221