• DocumentCode
    1890591
  • Title

    A modular, extendible and reusable test configuration for system-level manufacturing tests

  • Author

    TuMcakir, Muharrem ; Yesil, Cinar ; Coteli, Mert Burkay

  • Author_Institution
    Defense Syst. Technol. Dept., ASELSAN Inc., Ankara, Turkey
  • fYear
    2013
  • fDate
    16-19 Sept. 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper explores an effective solution for a test configuration to perform system-level manufacturing tests without use of system management/user interface software of system under test (SUT). A generic, computer aided and modular test configuration, which acts in combination and in an integrated way with the management unit(s) of the SUT over Ethernet connectivity is proposed as a solution. Using enough number of software modules to be installed on the management unit(s), the proposed test configuration provides a number of improvements compared to the existing test configurations. Parallel testing capability is one of these major improvements meaning that test scenarios may be applied to a certain number of SUTs at the same time independently. This feature accelerates the system-level manufacturing test activities both during the planned test operations and during fault localization cases. The proposed configuration is implemented and used on various systems based on various platforms such as; sheltered C4I platforms, tracked observer or gun platforms, wheeled ground surveying platforms etc.
  • Keywords
    automatic test equipment; local area networks; Ethernet connectivity; computer aided test configuration; extendible test configuration; modular test configuration; parallel testing capability; reusable test configuration; system-level manufacturing tests; Built-in self-test; Computers; Hardware; Manufacturing; Software; User interfaces; XML; Automatic Test System; Ethernet; System Manufacturing Tests; Test Configuration; XML;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    AUTOTESTCON, 2013 IEEE
  • Conference_Location
    Schaumburg, IL
  • ISSN
    1088-7725
  • Print_ISBN
    978-1-4673-5681-7
  • Type

    conf

  • DOI
    10.1109/AUTEST.2013.6645037
  • Filename
    6645037