Author :
Howard, John ; Dighe, S. ; Hoskote, Yatin ; Vangal, Sriram ; Finan, D. ; Ruhl, G. ; Jenkins, Devon ; Wilson, H. ; Borkar, N. ; Schrom, Gerhard ; Pailet, F. ; Jain, Sonal ; Jacob, Tony ; Yada, S. ; Marella, S. ; Salihundam, P. ; Erraguntla, V. ; Konow, M.
Author_Institution :
Intel, Hillsboro, OR, USA
Abstract :
A 567 mm2 processor on 45 nm CMOS integrates 48 IA-32 cores and 4 DDR3 channels in a 6Ã4 2D-mesh network. Cores communicate through message passing using 384 KB of on-die shared memory. Fine-grain power management takes advantage of 8 voltage and 28 frequency islands to allow independent DVFS of cores and mesh. As performance scales, the processor dissipates between 25 W and 125 W.