Title :
Reliability evaluation of a high-density thin-film multichip module
Author_Institution :
Digital Equipment Corp., Albuquerque, NM, USA
Abstract :
The author describes the reliability evaluation of such a module through all phases of the program-from the early reliability prediction, through the subsequent reliability testing, to the later analysis of the field reliability performance data. He also reviews and compares the mean-time-between-failure (MTBF) design prediction goals versus the Monte Carlo simulation results, as well as the actual field-performance data over a 24-month period using various reliability assessment methods and techniques
Keywords :
Monte Carlo methods; circuit reliability; integrated circuit testing; multichip modules; thin film circuits; MTBF; Monte Carlo simulation; field-performance data; high-density thin-film multichip module; mean-time-between-failure; reliability evaluation; reliability prediction; reliability testing; Bonding; Costs; Integrated circuit interconnections; Integrated circuit technology; Manufacturing processes; Multichip modules; Performance analysis; Predictive models; Substrates; Transistors;
Conference_Titel :
Reliability and Maintainability Symposium, 1993. Proceedings., Annual
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0943-X
DOI :
10.1109/RAMS.1993.296875
