DocumentCode :
1890855
Title :
The Bulk Temperature Analysis of the Involute Spur Gear Based on Parameterized Modeling of APDL
Author :
Peng Jie ; Liu Shaojun ; Hu Xiaozhou
Author_Institution :
Coll. of Mech. & Electr. Eng., Central South Univ., Changsha, China
fYear :
2013
fDate :
16-17 Jan. 2013
Firstpage :
1146
Lastpage :
1149
Abstract :
Because of large amounts of heat generation, spur gear transmission of heavy load and high speed can not only have a serious effect on the temperature field of the whole transmission system, but also lead to thermal deformation, which can badly affect the working reliability and the lifetime. With the complex application of gear meshing, friction and thermal conduction, heat flux and heat transfer coefficient for the contact surface and the sides in different engagement position are analyzed precisely. The parameterized three-dimensional finite model of a single tooth segment is built up on the basis of APDL in ANSYS, and the steady temperature field of the tooth segment is obtained. The effect of different torques and speeds on the steady temperature field is also analyzed.
Keywords :
deformation; durability; finite element analysis; friction; gears; heat conduction; mechanical contact; mechanical engineering computing; power transmission (mechanical); product life cycle management; reliability; torque; ANSYS; APDL; contact surface; engagement position; friction; gear meshing; heat flux; heat generation; heat transfer coefficient; parameterized three-dimensional finite model; single tooth segment; spur gear transmission system; steady temperature field; thermal conduction; thermal deformation; tooth segment; torques; working reliability; Analytical models; Finite element analysis; Gears; Heat transfer; Heating; Solid modeling; Temperature distribution; Bulk Temperature; Heat Convection; Heat Flux; Modeling with APDL; Spur Gear;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Measuring Technology and Mechatronics Automation (ICMTMA), 2013 Fifth International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4673-5652-7
Type :
conf
DOI :
10.1109/ICMTMA.2013.280
Filename :
6493933
Link To Document :
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