• DocumentCode
    1892082
  • Title

    Fabrication of 3-dimensionally shaped Si diaphragm dynamic focusing mirror

  • Author

    Hisanaga, Michio ; Koumura, Tslikasa ; Hattori, Tadashi

  • Author_Institution
    Nippondenso Co. Ltd., Aichi, Japan
  • fYear
    1993
  • fDate
    7-10 Feb 1993
  • Firstpage
    30
  • Lastpage
    35
  • Abstract
    To obtain a dynamic focusing mirror with optically ideal or parabolic deformation, a thin Si diaphragm with a 3-D specific thickness profile has been fabricated by a unique processing method. The specific thickness profile which allows optically ideal deformation is determined by the finite-element method (FEM). The mirror is approximately 10 mm in diameter and 9-μm in thickness. Its specific profile of the mirror is created by a dry-etching method. Photoresist on a Si substrate is first exposed to a specific energy profile through a mask made by the dither method. The photoresist is then developed to form a specific curved profile which complies with the optical energy profile. The curved profile is transcribed to the Si substrate by dry etching in CF4 /O2 plasma. The processed 3-D profile matches the design with less than 2% deviation
  • Keywords
    diaphragms; elemental semiconductors; finite element analysis; focusing; masks; micromechanical devices; mirrors; optical workshop techniques; photolithography; silicon; sputter etching; 3-D profile; 3-dimensionally shaped; Si; curved profile; dither method; dry-etching method; dynamic focusing mirror; elemental semiconductor; fabrication; finite-element method; mask; micro-optics; micromachining; optically ideal deformation; parabolic deformation; photoresist; plasma etching; specific thickness profile; thin Si diaphragm; Etching; Fabrication; Focusing; Laboratories; Mirrors; Optical design; Optical distortion; Process design; Resists; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.
  • Conference_Location
    Fort Lauderdale, FL
  • Print_ISBN
    0-7803-0957-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1993.296946
  • Filename
    296946