YAG laser assisted etching for releasing silicon micro structure

Author

Minami, Kazuyuki ; Wakabayashi, Yuji ; Matsubara, Takeshi ; Yoshimi, Kenichi ; Yoshida, Masayuki ; Esashi, Masayoshi

Author_Institution

Fac. of Eng., Tohoku Univ., Sendai, Japan

fYear

1993

fDate

7-10 Feb 1993

Firstpage

53

Lastpage

58

Abstract

YAG laser assisted etching techniques were developed and investigated for releasing silicon micro structures. HCl, SF₆ etc., which produce volatile exhaust, were used as etching gas at atmospheric pressure. The YAG laser assisted etching was applied to fabricate an electrostatic microactuator, a resonating sensor and accelerometers. This resistless dry etching can be applied to three-dimensional structures

Keywords

accelerometers; electric actuators; electric sensing devices; electrostatic devices; elemental semiconductors; etching; laser beam applications; micromechanical devices; silicon; HCl etchant; SF₆ etchant; Si; Si microstructures; YAG laser assisted etching; YAl5O12; accelerometers; atmospheric pressure; electrostatic microactuator; elemental semiconductor; resistless dry etching; resonating sensor; three-dimensional structures; Dry etching; Gas lasers; Glass; Laser beams; Microactuators; Optical beams; Silicon; Structural beams; TV; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.

Conference_Location

Fort Lauderdale, FL

Print_ISBN

0-7803-0957-X

Type

conf

DOI

10.1109/MEMSYS.1993.296951

Filename

296951