DocumentCode
1892201
Title
RF passives modeling for a multilayer PCB design library
Author
Vaesen, Kristof ; Jansen, Roelof ; De Raedt, Walter ; Kuwabara, Hiroshi ; Kishi, Takahiko ; Nawa, Kazunari ; Bessho, Takeshi
Author_Institution
IMEC, RFCDM-SSET, Leuven, Belgium
fYear
2010
fDate
10-14 Jan. 2010
Firstpage
412
Lastpage
415
Abstract
In this work a RF component design library has been developed for high performance 6-layered PCBs using a new plating technology. The design library consists of scalable models that are fitted on measurements. It is shown that the high performance PCB exhibits a better transmission line RF performance and also higher Q values for integrated inductors.
Keywords
printed circuit design; transmission lines; 6-layered PCBs; RF passives modeling; integrated inductors; multilayer PCB design library; transmission line RF performance; Capacitors; Copper; Costs; Dielectrics; Inductors; Libraries; Nonhomogeneous media; Packaging; Radio frequency; Transmission lines; Design Library; PCB; RF-SiP; passives; plating technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio and Wireless Symposium (RWS), 2010 IEEE
Conference_Location
New Orleans, LA
Print_ISBN
978-1-4244-4725-1
Electronic_ISBN
978-1-4244-4726-8
Type
conf
DOI
10.1109/RWS.2010.5434136
Filename
5434136
Link To Document