• DocumentCode
    1892224
  • Title

    Micro-grid fabrication of fluorinated polyimide by using magnetically controlled reactive ion etching (MC-RIE)

  • Author

    Furuya, Akinori ; Shimokawa, Fusao ; Matsuura, Tohru ; Sawada, Renshi

  • Author_Institution
    NTT Interdisciplinary Res. Lab., Tokyo, Japan
  • fYear
    1993
  • fDate
    7-10 Feb 1993
  • Firstpage
    59
  • Lastpage
    64
  • Abstract
    A micro grid consisting of 100-μm-high pole-shaped counterelectrode elements arranged like a pair of interleaved combs was fabricated using a fluorinated polyimide as structural material and metallization and lift-off using a ZnO sacrificial layer. Research into the magnetically controlled reactive ion etching (MC-RIE) of fluorinated polyimide substrate has resulted in an etching selectivity of up to 2600. These conditions result in a smooth etched surface. Shaped constructions hundreds of micrometers high with a good perpendicular shape can be formed using the MC-RIE technique for fluorinated polyimide micro-fabrication. Moreover, many kinds of 3-D structural devices can be manufactured when this technology is combined to a lift-off method using a ZnO sacrificial layer
  • Keywords
    microassembling; micromechanical devices; polymer films; sputter etching; 3-D structural devices; ZnO sacrificial layer; etching selectivity; fluorinated polyimide; interleaved combs; lift-off; magnetically controlled reactive ion etching; metallization; microgrid fabrication; micromachining; opto-micromachining; pole-shaped counterelectrode elements; shaped constructions; smooth etched surface; Electrodes; Etching; Fabrication; Gold; Machining; Magnetic materials; Plasma applications; Polyimides; Resists; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.
  • Conference_Location
    Fort Lauderdale, FL
  • Print_ISBN
    0-7803-0957-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1993.296952
  • Filename
    296952