• DocumentCode
    1892286
  • Title

    Improving diffusion furnace capability using model-based temperature control in a production environment

  • Author

    Yelverton, Mark ; Stoddard, Kevin ; Cusson, Brian ; Timmons, Tom

  • Author_Institution
    AMD Inc., Austin, TX, USA
  • fYear
    1997
  • fDate
    6-8 Oct 1997
  • Abstract
    This paper describes the design, development, and implementation of model-based temperature control (MBTC) to improve diffusion furnace capability in a production environment. An integrated manufacturable approach for modeling and robust H multivariable controller design is developed to replace standard proportional integral derivative (PID) furnace control. The design was originally evaluated on an oxidation furnace and is presently being propagated throughout the entire diffusion area. Production results demonstrate excellent temperature control, tighter process results, and increased utilization. Manually induced disturbances during ironman testing, as well as normal production disturbances, have shown the system requires no adjustment or reconfiguration for improved control of oxidation growth and LPCVD film deposition
  • Keywords
    H control; computer integrated manufacturing; electric furnaces; integrated circuit manufacture; process control; robust control; semiconductor technology; temperature control; LPCVD film deposition; advanced process control; diffusion furnace capability improvement; implementation; increased utilization; integrated manufacturable approach; ironman testing; manually induced disturbances; model-based temperature control; normal production disturbances; oxidation growth; production environment; robust H multivariable controller design; semiconductor production; uncertainty bounds; Furnaces; Oxidation; PD control; Pi control; Production; Proportional control; Robust control; Standards development; Temperature control; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3752-2
  • Type

    conf

  • DOI
    10.1109/ISSM.1997.664522
  • Filename
    664522