A dry-release method based on polymer columns for microstructure fabrication

Author

Mastrangelo, C.H. ; Saloka, G.S.

Author_Institution

Ford Motor Co., Dearborn, MI, USA

fYear

1993

fDate

7-10 Feb 1993

Firstpage

77

Lastpage

81

Abstract

A fabrication process that eliminates the adhesion of surface-micromachined suspended mechanical structures to the underlying substrate during a sacrificial-etch release is presented. The method is based on the construction of a periodic array of polymer columns or rubber feet that stiffen the structure during the sacrificial etch. Flat polycrystalline silicon plates measuring 3000×3000×1-μm suspended 1 μm above the substrate are easily fabricated by this method. This process has applications in the fabrication of micromachined plates used in devices such as accelerometers and pressure sensors

Keywords

etching; micromechanical devices; Si; accelerometers; dry-release method; elemental semiconductor; fabrication; flat Si plates; micromachined plates; microstructure fabrication; periodic array; polycrystalline plates; polymer columns; pressure sensors; rubber feet; sacrificial-etch release; Adhesives; Dry etching; Fabrication; Force sensors; Microstructure; Plasma applications; Plasma temperature; Polymers; Transducers; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1993, MEMS '93, Proceedings An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE.

Conference_Location

Fort Lauderdale, FL

Print_ISBN

0-7803-0957-X

Type

conf

DOI

10.1109/MEMSYS.1993.296955

Filename

296955