Meshless modeling of massive number of vias in interconnects by full-wave analysis

Author

Guo, Zhonghai ; Pan, George W.

Author_Institution

Electr. Eng. Dept., Tempe, AZ, USA

fYear

2010

fDate

11-17 July 2010

Firstpage

1

Lastpage

4

Abstract

In this paper, a full wave approach was proposed for the investigation of frequency dependent propagation characteristics of multiple through hole vias in the interior layer of multi-layered packaging environment. The current distributions on the vertical through hole vias are acquired and the crosstalk among the vias is investigated. This method can be applied to high-density and high-speed multiple layer circuit with less CPU time and memory compared to numerical methods. The results are obtained for vias in one layer and are compared against that of HFSS with excellent agreement.

Keywords

Fourier transforms; Galerkin method; electric field integral equations; electromagnetic wave propagation; interconnections; magnetic materials; HFSS; current distributions; frequency dependent propagation characteristics; full-wave analysis; high-density multiple-layer circuit; high-speed multiple-layer circuit; meshless modeling; multilayered packaging environment; multiple through hole vias; Admittance; Analytical models; Arrays; Fourier series; Magnetic resonance imaging; Software; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE

Conference_Location

Toronto, ON

ISSN

1522-3965

Print_ISBN

978-1-4244-4967-5

Type

conf

DOI

10.1109/APS.2010.5561855

Filename

5561855