Encapsulation processes for magnetic components and their effect on component functionality

Author

Arris, Howard W.

fYear

2001

fDate

2001

Firstpage

149

Lastpage

153

Abstract

Sandia National Laboratories has been encapsulating magnetic components for over 40 years. The design of magnetic component assemblies that must withstand a variety of environments and then function correctly is dependent on the appropriate use of encapsulating formulations. Specially developed material processing parameters are often critical in the encapsulation process and enable us to provide high reliability magnetic components. This paper discusses encapsulation process parameters for several of our formulations utilized for magnetic components. Process deviations that affect component functionality are also discussed

Keywords

encapsulation; magnetic devices; transformers; Sandia National Laboratories; encapsulating formulations; encapsulation process parameters; epoxy processing; high reliability magnetic components; inductors; magnetic components; magnetic components encapsulation; material mixing; material processing parameters; polyurethane foam processing; solenoid coils; transformers; urethane processing; vacuum encapsulation; Assembly; Encapsulation; History; Insulation; Laboratories; Magnetic materials; Manufacturing processes; Materials processing; Moisture; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings

Conference_Location

Cincinnati, OH

ISSN

0362-2479

Print_ISBN

0-7803-7180-1

Type

conf

DOI

10.1109/EEIC.2001.965603

Filename

965603