DocumentCode
1892843
Title
Pushing the limits of lithography for IC production
Author
Brunner, T.
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
1997
fDate
10-10 Dec. 1997
Firstpage
9
Lastpage
13
Abstract
Advanced lithography approaches will be reviewed from the point of view of volume production applications. Three key questions will be considered: 1. At what design rule will optical lithography die? 2. What are the requirements for a production-worthy lithography? 3. What are the prospects for a non-optical lithography meeting all of these requirements? The high productivity and maturity of optical lithographic processes constitutes a huge "activation energy barrier" that any non-optical approach must break through. At the present time, all non-optical lithographic techniques are far behind the overall production capability of optical techniques. 1x X-ray proximity printing is the most mature post-optical lithography.
Keywords
integrated circuit technology; lithography; IC production; X-ray proximity printing; design rule; lithography; nonoptical lithography; optical lithography; productivity; volume production; Costs; Lithography; Optical devices; Optical distortion; Optical films; Optical noise; Pattern matching; Production; Productivity; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-4100-7
Type
conf
DOI
10.1109/IEDM.1997.649433
Filename
649433
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