DocumentCode
1893293
Title
Conductive composites based on PDVF-C/sub 2/F/sub 3/H and substituted or pure poly(pyrroles)
Author
Boiteux, G. ; Ho-Hoang, A. ; Fache, F. ; Lemaire, Martin ; Jeszka, J.K.
Author_Institution
Centre of Molecular and Macromolecular Studies
fYear
1994
fDate
24-29 July 1994
Firstpage
255
Lastpage
255
Abstract
Summary form only given. The high stability of the poly(pyrrole) in its conductive state allows different chemical functionalizations in position /sub 3/ with fluorinated groups to obtain new materials with interesting properties. Up to now there are few works on conductive composites based on a blend of poly(pyrrole) or derivatives with the insulating matrix PVDF-C/sub 2/F/sub 3/H. For these reasons it was convenient to study such composites to try to combine the conductive properties of the first component with the thermal and mechanical properties of the copolymer of PVDF. The materials were prepared in two steps. First casting films of a solution of PVDF-C/sub 2/F/sub 3/H at 50g/l in acetone were realized on ITO glasses. In the second step such supports were pooled in a solution of propylene carbonate containing 0.2M of pyrrole or substituted pyrroles and 0.2/M of BuNBF/sub 4/. The variation of the conductivity of the composites has been studied in function of the percent in weight of the conductive component polymerized in the insulating matrix. A small amount of 1% allows to reach high conductivity in the range of about 6Scm/sup -l/. The relationship between the processability of such composites and relative structure of the guest polymer and of the conductive polymer must be established. The thermal behavior of the composites should inform us about the thermal stability and the nature of the conductivity.
Keywords
Chemical elements; Conducting materials; Electrochromism; Mechanical factors; Morphology; Out of order; Oxidation; Polymers; Stability; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Science and Technology of Synthetic Metals, 1994. ICSM '94. International Conference on
Conference_Location
Seoul, Korea
Type
conf
DOI
10.1109/STSM.1994.835244
Filename
835244
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