• DocumentCode
    1893361
  • Title

    Self-heating effects in gate-all-around silicon nanowire MOSFETs: Modeling and analysis

  • Author

    Huang, Xin ; Zhang, Tianwei ; Wang, Rusheng ; Liu, Changze ; Liu, Yuchao ; Huang, Ru

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2012
  • fDate
    19-21 March 2012
  • Firstpage
    727
  • Lastpage
    731
  • Abstract
    In this paper, an electro-thermal model is proposed for the first time to accurately investigate the self-heating effects in gate-all-around (GAA) silicon nanowire MOSFETs (SNWTs) for thermal-aware design optimization. The model is derived based on the equivalent thermal network method, in which the impacts of gate length dependence, nanowire diameter dependence and surface roughness on the nanowire channel thermal conductivity as well as the influence of unique GAA structure features on the heat dissipation are taken into account. The proposed model agrees well with the experimental results of SNWTs. Based on the model, the impacts of structure parameters on the current driving capabilities and heat dissipation of SNWTs are discussed. The developed electro-thermal model can be further applied to the thermal-aware design of SNWT-based circuits.
  • Keywords
    MOSFET; cooling; elemental semiconductors; nanowires; silicon; surface roughness; thermal conductivity; GAA structure features; SNWT-based circuits; Si; driving capabilities; electrothermal model; equivalent thermal network method; gate length dependence; gate-all-around nanowire MOSFET; heat dissipation; nanowire channel thermal conductivity; nanowire diameter dependence; self-heating effects; structure parameters; surface roughness; thermal-aware design optimization; Conductivity; Integrated circuit modeling; Logic gates; Silicon; Thermal conductivity; Thermal resistance; Gate-all-around (GAA); equivalent thermal network; self-heating effect; silicon nanowire MOSFET (SNWT);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2012 13th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-1034-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2012.6187572
  • Filename
    6187572