Hot peripheral thermal management to mitigate cache temperature variation

Modern microprocessor caches are often regarded as cool chip components that dissipate power uniformly. This research demonstrates that this uniformity is a misconception. Memory cell peripherals dissipate considerably higher power than the actual memory cell and this can result in up to 30°C of temperature difference between the warmest and the coolest part of the cache. To be effective and accurate, cache temperature and power modeling and management must take this effect into account. Further, this paper focuses on the surrounding logic of the memory cell and applies two novel techniques, peripheral bit swapping (PBS) and peripheral monitor and shutdown (PMSD), to reduce the thermal variation as well as reduce the corresponding steady-state temperature and leakage power of the cache. Overall, these techniques decrease temperature by 8°C for the L1 Data Cache and 5°C for the shared L2 cache and reduce their thermal gradient by more than 75%, on average.