Title :
Characterization of electrical packages via simulation and measurement
Author :
Luk, Timwah ; Hosseini, Mahdi
Author_Institution :
National Semiconductor Corp., South Portland, ME, USA
Abstract :
A methodology that makes use of the advantages of both electromagnetic simulation and measurement to characterize integrated circuit packages is presented. The advantages, limitations and procedures to improve the accuracy of both methods are discussed. Results from both methods are compared. An accurate prediction of circuit performance is achieved with packaging models generated by this methodology
Keywords :
circuit analysis computing; inductance; integrated circuit technology; packaging; EM simulator VAMOM; accuracy; circuit performance; electrical package characterisation; electromagnetic simulation; inductance; integrated circuit packages; measurement; packaging models; Capacitance; Circuit simulation; Conductors; Electric variables measurement; Geometry; Inductance; Integrated circuit measurements; Integrated circuit packaging; Semiconductor device packaging; Solid modeling;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location :
Research Triangle Park, NC
Print_ISBN :
0-7803-0990-1
DOI :
10.1109/UGIM.1993.297015
