DocumentCode :
1893516
Title :
An integrated approach to planning and scheduling at Philips Semiconductors
Author :
Malmstrom, Cherie
Author_Institution :
Philips Semicond., Albuquerque, NM, USA
fYear :
1997
fDate :
6-8 Oct 1997
Abstract :
One of the most difficult environments for planning and scheduling is semiconductor fabrication. Some of these challenges include: high occurrence of breakdowns and scraps, highly fluctuating demands, interplant dependency, long lead-times with large numbers of iterative and complex processes, a diverse and rapidly evolving demand mix, and multiple production sites, geographic dispersion of fabrication and assembly/test, and outsourcing. These attributes of semiconductor fabrication create a highly dynamic environment under intense economic and technological pressure, compounded by global distribution of the manufacturing process. To successfully handle dynamism and the “networked” semiconductor enterprise requires a dynamic even “real-time”, advanced planning and scheduling (APS) system that is tightly, integrated with all parts of the enterprise supply chain, from order entry, to material purchasing, through shop-floor lot sequencing
Keywords :
planning; production control; production engineering computing; scheduling; semiconductor device manufacture; Philips Semiconductors; breakdowns; complex processes; economic and technological pressure; enterprise supply chain; geographic dispersion; global distribution; iterative and complex processes; lead-times; material purchasing; multiple production si; outsourcing; planning; scheduling; scraps; semiconductor fabrication; shop-floor lot sequencing; technological pressure; Assembly; Electric breakdown; Environmental economics; Fabrication; Job shop scheduling; Manufacturing processes; Materials requirements planning; Outsourcing; Production; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
Type :
conf
DOI :
10.1109/ISSM.1997.664528
Filename :
664528
Link To Document :
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