DocumentCode :
1893769
Title :
Study of process induced localized elevated oxygen concentration in strained boron doped sub-50 nm SiGeC base layers for high frequency npn HBTs
Author :
Enicks, Darwin ; Oleszek, Gerald
Author_Institution :
Atmel Corp., Colorado Springs, CO, USA
fYear :
2005
fDate :
9-11 May 2005
Firstpage :
195
Lastpage :
198
Abstract :
This work is believed to be the first report of localized elevated oxygen concentration (or pileup), which occurs with thermal anneals of strained, boron doped SiGeC layers. The thermally activated oxygen updiffusion is directly correlated to concentrations of germanium, carbon, and boron. A strong dependency on prebake temperature was also found. SIMS (secondary ion mass spectrometry) measurements were made to verify O, C, B, and Ge concentrations in SiGeC layers following low temp growth by LPCVD (low pressure chemical vapor deposition) and also following thermal anneal.
Keywords :
Ge-Si alloys; annealing; chemical vapour deposition; heterojunction bipolar transistors; oxidation; secondary ion mass spectroscopy; SiGeC; high frequency npn HBT; localized elevated oxygen concentration; low pressure chemical vapor deposition; prebake temperature; secondary ion mass spectrometry; thermal anneal; Annealing; Boron; Frequency; Germanium; Heterojunction bipolar transistors; Inductors; Oxygen; Silicon; Springs; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology, 2005. ICICDT 2005. 2005 International Conference on
Print_ISBN :
0-7803-9081-4
Type :
conf
DOI :
10.1109/ICICDT.2005.1502628
Filename :
1502628
Link To Document :
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