DocumentCode :
1893923
Title :
AlGaN/GaN HEMTs for energy efficient systems
Author :
Gaska, R. ; Simin, G. ; Shur, M.
Author_Institution :
Electron. Technol., Inc., Columbia, SC, USA
fYear :
2013
fDate :
21-23 May 2013
Firstpage :
1
Lastpage :
6
Abstract :
Materials properties of nitride semiconductors make them superior candidates for power electronics applications. Materials quality, strongly non-uniform field distribution, variations of parameters from device to device, and reliability problems have to be improved or resolved. New designs, especially suitable to nitride devices, include the use of Low Conducting Layers, “composite channel structures, and novel contacts. All these improvement still have to be validated and improved to make the dream of nitride power electronics to be competitive with Si and SiC power transistors.
Keywords :
III-V semiconductors; power HEMT; power consumption; wide band gap semiconductors; AlGaN-GaN; HEMT; breakdown voltage off state; energy efficient systems; gallium nitride transistors; heterostructure field effect transistors; high electron mobility transistor; nitride power transistors; nitride semiconductors; power electronics applications; transistor switch on-resistance; Aluminum gallium nitride; Electric fields; Gallium nitride; HEMTs; Logic gates; MODFETs; Materials; GaN MISHFETs; III-N HEMTs; SPICE; breakdown voltage; patch antenna;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energytech, 2013 IEEE
Conference_Location :
Cleveland, OH
Type :
conf
DOI :
10.1109/EnergyTech.2013.6645294
Filename :
6645294
Link To Document :
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