Title :
Fabrication of thin-reliable multichip modules
Author :
Hess, Glenn T. ; Sanders, Thomas J. ; Miller, Roy ; Gsteiger, Kurt
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Inst. of Technol., Melbourne, FL, USA
Abstract :
The fabrication of thin, reliable multichip modules has been demonstrated by Florida Institute of Technology. This involved developing encapsulation techniques to build multichip modules (MCMs) with a thickness less than 0.05 inches. The ultimate goal of these encapsulation techniques is to provide hermetic performance at a low cost while meeting specific environmental conditions
Keywords :
circuit reliability; encapsulation; environmental testing; integrated circuit manufacture; multichip modules; Finesse software; MCM; encapsulation techniques; environmental test; hermetic performance; layout design; reliability; thin multichip module fabrication; Bonding; Costs; Etching; Fabrication; Gold; Multichip modules; Packaging; Substrates; Testing; Wire;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location :
Research Triangle Park, NC
Print_ISBN :
0-7803-0990-1
DOI :
10.1109/UGIM.1993.297037
