• DocumentCode
    1894107
  • Title

    Integration and packaging plateaus of processor performance

  • Author

    Jouppi, Norman P.

  • Author_Institution
    Digital Equipment Corp., Palo Alto, CA, USA
  • fYear
    1989
  • fDate
    2-4 Oct 1989
  • Firstpage
    229
  • Lastpage
    232
  • Abstract
    Integration and packaging performance limits are refined in the context of computer systems. In particular, limits of computer performance under various packaging, architectural, organizational, and design techniques (e.g. gate-array versus custom) are explored. It is concluded that fully integrated processors can have modest electrical signal I/O requirements because the frequency of signals crossing their pins can be several times less than that of the on-chip clock frequency. In order to exploit emerging technologies without high levels of integration, advanced volumetric packaging techniques will still be very important
  • Keywords
    packaging; performance evaluation; architectural; clock frequency; computer systems; design techniques; fully integrated processors; organizational; packaging performance limits; processor performance; Aging; Circuits and systems; Clocks; Computer architecture; Degradation; Delay; Heat sinks; Integrated circuit interconnections; Packaging machines; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 1989. ICCD '89. Proceedings., 1989 IEEE International Conference on
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-8186-1971-6
  • Type

    conf

  • DOI
    10.1109/ICCD.1989.63361
  • Filename
    63361