DocumentCode
1894107
Title
Integration and packaging plateaus of processor performance
Author
Jouppi, Norman P.
Author_Institution
Digital Equipment Corp., Palo Alto, CA, USA
fYear
1989
fDate
2-4 Oct 1989
Firstpage
229
Lastpage
232
Abstract
Integration and packaging performance limits are refined in the context of computer systems. In particular, limits of computer performance under various packaging, architectural, organizational, and design techniques (e.g. gate-array versus custom) are explored. It is concluded that fully integrated processors can have modest electrical signal I/O requirements because the frequency of signals crossing their pins can be several times less than that of the on-chip clock frequency. In order to exploit emerging technologies without high levels of integration, advanced volumetric packaging techniques will still be very important
Keywords
packaging; performance evaluation; architectural; clock frequency; computer systems; design techniques; fully integrated processors; organizational; packaging performance limits; processor performance; Aging; Circuits and systems; Clocks; Computer architecture; Degradation; Delay; Heat sinks; Integrated circuit interconnections; Packaging machines; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 1989. ICCD '89. Proceedings., 1989 IEEE International Conference on
Conference_Location
Cambridge, MA
Print_ISBN
0-8186-1971-6
Type
conf
DOI
10.1109/ICCD.1989.63361
Filename
63361
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