DocumentCode :
1894107
Title :
Integration and packaging plateaus of processor performance
Author :
Jouppi, Norman P.
Author_Institution :
Digital Equipment Corp., Palo Alto, CA, USA
fYear :
1989
fDate :
2-4 Oct 1989
Firstpage :
229
Lastpage :
232
Abstract :
Integration and packaging performance limits are refined in the context of computer systems. In particular, limits of computer performance under various packaging, architectural, organizational, and design techniques (e.g. gate-array versus custom) are explored. It is concluded that fully integrated processors can have modest electrical signal I/O requirements because the frequency of signals crossing their pins can be several times less than that of the on-chip clock frequency. In order to exploit emerging technologies without high levels of integration, advanced volumetric packaging techniques will still be very important
Keywords :
packaging; performance evaluation; architectural; clock frequency; computer systems; design techniques; fully integrated processors; organizational; packaging performance limits; processor performance; Aging; Circuits and systems; Clocks; Computer architecture; Degradation; Delay; Heat sinks; Integrated circuit interconnections; Packaging machines; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1989. ICCD '89. Proceedings., 1989 IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-1971-6
Type :
conf
DOI :
10.1109/ICCD.1989.63361
Filename :
63361
Link To Document :
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