Title :
Fast PatchMatch stereo matching using cross-scale cost fusion for automotive applications
Author :
Ji-Ho Cho ; Humenberger, Martin
Author_Institution :
Inst. of Software Technol. & Interactive Syst., Vienna Univ. of Technol., Vienna, Austria
fDate :
June 28 2015-July 1 2015
Abstract :
Due to recent developments of low-cost image sensors and high-performance embedded processing hardware, future cars and automotive systems will increasingly use binocular stereo vision for environmental perception. However, research and development in stereo vision is still ongoing since there are many challenges unsolved. In this paper, we propose a fast and accurate stereo matching algorithm, designed for automotive applications. It convincingly handles real-world scenes containing complex, textureless, and slanted surfaces. To achieve that, we propose an improved PatchMatch stereo algorithm that combines a census-based cost function with Semi-Global Matching optimization integrated in a cross-scale fusion processing scheme. To further accelerate the algorithm, we propose a novel enhancement approach for PatchMatch-based approximation which allows us to skip the random search or at least significantly reduce the number of iterations. Our method is ranked in the upper third of the KITTI benchmark and among the top performers in terms of processing time.
Keywords :
approximation theory; image enhancement; image fusion; image matching; optimisation; stereo image processing; traffic engineering computing; KITTI benchmark; PatchMatch stereo matching; PatchMatch-based approximation; automotive applications; binocular stereo vision; census-based cost function; cross-scale cost fusion; environmental perception; high-performance embedded processing hardware; image enhancement approach; low-cost image sensors; semiglobal matching optimization; Approximation algorithms; Approximation methods; Automotive applications; Cost function; Graphics processing units; Stereo vision;
Conference_Titel :
Intelligent Vehicles Symposium (IV), 2015 IEEE
Conference_Location :
Seoul
DOI :
10.1109/IVS.2015.7225783