DocumentCode :
1894267
Title :
Microelectronic packaging technology transfer
Author :
Rust, Carl A. ; Key, James
Author_Institution :
CALCE Electron. Packaging Res. Center, Maryland Univ., College Part, MD, USA
fYear :
1993
fDate :
18-19 May 1993
Firstpage :
10
Lastpage :
16
Abstract :
The appropriate and efficient technology transfer mechanism will vary, depending on individual company circumstances and needs. It is important for research organizations to have multiple mechanisms in place to meet the diverse needs of research sponsors. The Computer Aided Life Cycle Engineering Electronic Packaging Research Center (CALCE EPRC) at the University of Maryland has considerable experience in efficient technology transfer mechanisms. A comparative view of different mechanisms is discussed. The use of software as a primary technology transfer mechanism is addressed. The supplemental activities of CALCE EPRC are reported
Keywords :
integrated circuit technology; packaging; technology transfer; CALCE EPRC; analysis program; computer aided life cycle engineering; design program; electronic packaging; microelectronic packaging technology transfer; primary technology transfer mechanism; research organizations; software; Companies; Computational modeling; Educational institutions; Electronic equipment; Electronics packaging; Government; Laboratories; Microelectronics; Personnel; Technology transfer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location :
Research Triangle Park, NC
ISSN :
0749-6877
Print_ISBN :
0-7803-0990-1
Type :
conf
DOI :
10.1109/UGIM.1993.297045
Filename :
297045
Link To Document :
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