Title :
Thermal, mechanical and multi-physics simulation and experiments in micro electronics and micro-systems
Abstract :
Presents the front cover of the proceedings.
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Conference_Location :
Berlin, Germany
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502749
