DocumentCode
1894441
Title
Design and operation of a cluster-tool-based rapid thermal processing module
Author
Bayoumi, Am M. ; Silvestre, Conrad L. ; Keuhn, R.T. ; Hauser, John R.
Author_Institution
NSF Eng. Res. Center for Adv. Electron. Mater. Process, North Carolina State Univ., Raleigh, NC, USA
fYear
1993
fDate
18-19 May 1993
Firstpage
203
Lastpage
207
Abstract
A cluster tool rapid thermal processing module for single wafer processing is described. The various design and actual implementation issues are discussed, together with the operational characteristics. The module is then evaluated as a low thermal budget tool for MOS gate stack formation. Film quality is electrically assessed
Keywords
integrated circuit manufacture; modules; plasma CVD; rapid thermal processing; surface treatment; MOS capacitors; MOS gate stack formation; cluster tool rapid thermal processing module; film quality; low thermal budget tool; operational characteristics; plasma cleaning; remote plasma enhanced chemical vapour deposition; single wafer processing; thermal processing module design; Cleaning; Computerized monitoring; Hydrogen; Lamps; Nitrogen; Plasma chemistry; Plasma materials processing; Pressure control; Rapid thermal processing; Windows;
fLanguage
English
Publisher
ieee
Conference_Titel
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location
Research Triangle Park, NC
ISSN
0749-6877
Print_ISBN
0-7803-0990-1
Type
conf
DOI
10.1109/UGIM.1993.297053
Filename
297053
Link To Document