Title :
Nanoreliability-combined simulation and testing
Author_Institution :
Fraunhofer Micro Mater. Center, Berlin, Germany
Abstract :
Reliability has become most important for the wide application of microand nanotechnologies as well. Thermal misfit problems, complex loading conditions, creep, fatigue and vibrations exert a great influence on the reliability of tiny structures and components. MicroDAC and nanoDAC local deformation measurements combined with fully parameterized simulation enable to characterize and evaluate the reliability behaviour of various components and materials in the micro-nano transition region. Nanoparticles, thin layers etc. are related to localized stress fields which have a dominant influence on strength and related physical quantities.
Keywords :
atomic force microscopy; crack detection; deformation; electronics packaging; finite element analysis; image processing; microcracks; nanostructured materials; nondestructive testing; reliability; atomic force microscopy; chip scale packaging; digital simulation; micro-nano transition region; microDAC local deformation; nanoDAC local deformation; nanoreliability; nanostructured materials; reliability behaviour; Capacitive sensors; Creep; Digital images; Displacement measurement; Electronic packaging thermal management; Fatigue; Materials reliability; Strain measurement; Testing; Thermal loading;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502759
