DocumentCode :
1894640
Title :
Development of a new air-cooling heatsink for a high density computer system
Author :
Takada, Junji ; Kimura, Yasuo ; Ogushi, Tetsurou ; Fujii, Masao ; Kohara, Masanobu ; Naka, Shin
Author_Institution :
Mitsubishi Electr. Corp., Tokyo, Japan
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
534
Abstract :
A novel forced-convection air-cooling heatsink constructed to meet increasing demands for high-speed and high-density computer equipment is discussed. The fin surface of the heatsink has many perforations and is bent to form a trapezoidal shape. The heatsink constructed with these fins has alternating expansion and contraction parts along the flow passage. The heat-transfer enhancement is studied experimentally by changing the fin-surface geometries, and the application to real equipment is investigated by a board-level model. It is shown that the heat-transfer coefficient of trapezoidal fins with many perforations is about two times that of the parallel plate fins for the same frontal velocity, and that this type of heatsink is applicable to computer cooling
Keywords :
cooling; heat sinks; packaging; air-cooling heatsink; board-level model; computer cooling; contraction; expansion; fin surface; flow passage; frontal velocity; heat-transfer coefficient; high density computer system; parallel plate fins; trapezoidal shape; Application software; Drag; Electron traps; Electronic equipment; Electronics cooling; Heat pumps; Heat transfer; Laboratories; Shape; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122239
Filename :
122239
Link To Document :
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