DocumentCode
1894640
Title
Development of a new air-cooling heatsink for a high density computer system
Author
Takada, Junji ; Kimura, Yasuo ; Ogushi, Tetsurou ; Fujii, Masao ; Kohara, Masanobu ; Naka, Shin
Author_Institution
Mitsubishi Electr. Corp., Tokyo, Japan
fYear
1990
fDate
20-23 May 1990
Firstpage
534
Abstract
A novel forced-convection air-cooling heatsink constructed to meet increasing demands for high-speed and high-density computer equipment is discussed. The fin surface of the heatsink has many perforations and is bent to form a trapezoidal shape. The heatsink constructed with these fins has alternating expansion and contraction parts along the flow passage. The heat-transfer enhancement is studied experimentally by changing the fin-surface geometries, and the application to real equipment is investigated by a board-level model. It is shown that the heat-transfer coefficient of trapezoidal fins with many perforations is about two times that of the parallel plate fins for the same frontal velocity, and that this type of heatsink is applicable to computer cooling
Keywords
cooling; heat sinks; packaging; air-cooling heatsink; board-level model; computer cooling; contraction; expansion; fin surface; flow passage; frontal velocity; heat-transfer coefficient; high density computer system; parallel plate fins; trapezoidal shape; Application software; Drag; Electron traps; Electronic equipment; Electronics cooling; Heat pumps; Heat transfer; Laboratories; Shape; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122239
Filename
122239
Link To Document