Title :
Sense and nonsense of heat transfer correlations applied to electronics cooling
Author :
Lasance, Clemens J M
Author_Institution :
Philips Res. Labs., Eindhoven, Netherlands
Abstract :
Generations of mechanical engineers have been educated to use the correlations that fill the textbooks Russell is mentioning because: "For convenience of engineering applications, correlation equations are developed over the entire range of dimensions and for any Pr-number". Unfortunately, for a thermal designer, real-life is more like hell than paradise, and hence it is high time to address the question: "How convenient are these correlations in real-life?" When it comes to thermal management of electronic systems, the answer is that correlations are not only completely useless but also dangerous because their use by nonexperts gives a false sense of safety. This paper tells why.
Keywords :
computational fluid dynamics; cooling; correlation methods; electronic engineering computing; statistical analysis; thermal management (packaging); computational fluid dynamics; electronics cooling; flow simulation; heat transfer correlations; thermal management; thermodynamics; Electronics cooling; Equations; Heat transfer; Physics; Steady-state; TV; Temperature;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502762