Title :
Chapter 3, Designing for interface reliability
Keywords :
Bonding processes; Electronic packaging thermal management; Finite element methods; Thermomechanical processes; Wafer bonding;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502765
