Title :
Thermo-mechanical finite-element modeling of a chip-on-foil bonding process
Author :
Suter, P. ; Bauknecht, R. ; Graf, T. ; Duran, H. ; Venter, I.
Author_Institution :
Inst. of Electron., HTA Luzern, Horw, Switzerland
Abstract :
A chip-on-foil (COF) inner-lead bonding (ILB) process for diplay driver ICs is studied by means of thermo-mechanical finite-element modeling (FEM). The residual stress distribution in the assembly after bonding is calculated for different bump arrangements and process parameters. The simulated foil induced shear force on the corner bumps could be correlated to experimentally observed corner bump failures. A redesign of the bumps decreased the failure rate after bonding from typically 1% to typically 0.01%.
Keywords :
chip scale packaging; chip-on-board packaging; elastic deformation; failure analysis; finite element analysis; foils; integrated circuit bonding; microassembling; chip scale packaging; chip-on-foil bonding process; corner bump failures; diplay driver ICs; elastic deformation; finite element analysis; inner-lead bonding; integrated circuit bonding; microassembling; residual stress distribution; simulated foil induced shear force; thermo-mechanical finite-element modeling; Analytical models; Assembly; Bonding processes; Finite element methods; Gold; Packaging; Temperature; Thermal stresses; Thermomechanical processes; Tin;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502766
