Thermo-mechanical finite-element modeling of a chip-on-foil bonding process

Author

Suter, P. ; Bauknecht, R. ; Graf, T. ; Duran, H. ; Venter, I.

Author_Institution

Inst. of Electron., HTA Luzern, Horw, Switzerland

fYear

2005

fDate

18-20 April 2005

Firstpage

25

Lastpage

30

Abstract

A chip-on-foil (COF) inner-lead bonding (ILB) process for diplay driver ICs is studied by means of thermo-mechanical finite-element modeling (FEM). The residual stress distribution in the assembly after bonding is calculated for different bump arrangements and process parameters. The simulated foil induced shear force on the corner bumps could be correlated to experimentally observed corner bump failures. A redesign of the bumps decreased the failure rate after bonding from typically 1% to typically 0.01%.

Keywords

chip scale packaging; chip-on-board packaging; elastic deformation; failure analysis; finite element analysis; foils; integrated circuit bonding; microassembling; chip scale packaging; chip-on-foil bonding process; corner bump failures; diplay driver ICs; elastic deformation; finite element analysis; inner-lead bonding; integrated circuit bonding; microassembling; residual stress distribution; simulated foil induced shear force; thermo-mechanical finite-element modeling; Analytical models; Assembly; Bonding processes; Finite element methods; Gold; Packaging; Temperature; Thermal stresses; Thermomechanical processes; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502766

Filename

1502766