Flexible thermal MEMS flow sensor based on Cu on polyimide substrate

Author

Shibata, Shunji ; Niimi, Yosuke ; Shikida, Mitsuhiro

Author_Institution

Dept. of Mech. Sci. Eng., Nagoya Univ., Nagoya, Japan

fYear

2014

fDate

2-5 Nov. 2014

Firstpage

424

Lastpage

427

Abstract

A flexible thermal flow sensor based on a Cu on polyimide (COP) substrate was developed for the first time. It has an advantage in that it can be mounted on non-planar surfaces, and, through having a low resistance, it can embed an electrical feed into the COP substrate. Metal film working as a flow sensing element was formed on a thin polyimide membrane produced by sacrificial etching. Flow sensing characteristics, such as the calibration curve and response waveform, were successfully obtained. The relationship between the sensor output and flow rate closely matched the calibration curve derived by King´s law. The obtained response times of both rising and falling were 0.50 s and 0.67 s, respectively.

Keywords

calibration; copper; etching; flow sensors; membranes; microsensors; polymers; temperature sensors; thin film sensors; COP; Cu; King´s law; calibration curve; electrical feed; flexible thermal MEMS flow sensor; nonplanar surface; polyimide substrate; sacrificial etching; thin polyimide membrane; time 0.50 s; time 0.67 s; Etching; Heating; Micromechanical devices; Polyimides; Substrates; Thermal sensors; flexible; thermal flow sensor;

fLanguage

English

Publisher

ieee

Conference_Titel

SENSORS, 2014 IEEE

Conference_Location

Valencia

Type

conf

DOI

10.1109/ICSENS.2014.6985025

Filename

6985025