DocumentCode :
189558
Title :
Sensory-evoked potential using a non-invasive flexible multi-channel dry EEG electrode with vibration motor stimulation
Author :
Chanmi Yeon ; Donghyeon Kim ; Kiseon Kim ; Euiheon Chung
Author_Institution :
Dept. of Med. Syst. Eng., Gwangju Inst. of Sci. & Technol., Gwangju, South Korea
fYear :
2014
fDate :
2-5 Nov. 2014
Firstpage :
519
Lastpage :
522
Abstract :
Electroencephalography (EEG) of the mouse brain allows monitoring neural activity of brain in disease model. In response to demand for safer and efficient animal experimental methods, we demonstrate functional brain activity in mice using a novel non-invasive flexible multi-channel dry EEG electrode with high temporal resolution. The plunger-barrel-spring assembly structure of electrode pins containing inner spring enables each pin to fit tightly onto curved scalp surface. Also, longitudinal observation is possible in multiple mice with reusability and non-invasiveness resulted from structural characteristics. In our experimental set-up, we recorded sensory-evoked potential for 6 male C57BL/6 mice under vibrational mechanical stimulation of the hindlimb and analyzed the signal using topoplot.
Keywords :
bioelectric potentials; biomechanics; biomedical electrodes; diseases; electroencephalography; neurophysiology; animal experimental methods; curved scalp surface; disease model; electrode pins; electroencephalography; high temporal resolution; hindlimb; inner spring; longitudinal observation; male C57BL/6 mice; mouse brain; neural activity monitoring; noninvasive flexible multichannel dry EEG electrode; noninvasiveness; plunger-barrel-spring assembly structure; reusability; sensory-evoked potential; structural characteristics; topoplot; vibration motor stimulation; vibrational mechanical stimulation; Brain modeling; Diseases; Electric potential; Electrodes; Electroencephalography; Mice; Electroencephalography (EEG); dry electrode; flexibility; non-invasiveness; sensory-evoked potential recording;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
Type :
conf
DOI :
10.1109/ICSENS.2014.6985049
Filename :
6985049
Link To Document :
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