DocumentCode :
1895727
Title :
Numerical analysis of SOI IGBT switching characteristics-switching speed enhancement by reducing the SOI thickness
Author :
Omura, Ichiro ; Yasuhara, Norio ; Nakagawa, Akio ; Suzuki, Yoshie
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fYear :
1993
fDate :
18-20 May 1993
Firstpage :
248
Lastpage :
253
Abstract :
The electrical characteristics of SOI (silicon-on-insulator) IGBTs (insulated-gate bipolar transistors), including breakdown voltage are discussed. It is found that the switching speed of an IGBT on a thin SOI is improved by reducing the SOI layer thickness without special design optimization. Carrier recombination at the Si-SiO2 interface is shown to affect carriers as if the bulk lifetime were reduced for a thin SOI, thus further improving the switching speed of IGBTs on thin (2-μm) SOIs
Keywords :
electric breakdown of solids; elemental semiconductors; insulated gate bipolar transistors; semiconductor-insulator boundaries; silicon; silicon compounds; SOI IGBT switching characteristics; SOI thickness; Si-SiO2 interface; breakdown voltage; bulk lifetime; electrical characteristics; switching speed enhancement; Breakdown voltage; Cathodes; Conductivity; Diodes; Impurities; Insulated gate bipolar transistors; Numerical analysis; Power integrated circuits; Shape; Tail;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 1993. ISPSD '93., Proceedings of the 5th International Symposium on
Conference_Location :
Monterey, CA
ISSN :
1063-6854
Print_ISBN :
0-7803-1313-5
Type :
conf
DOI :
10.1109/ISPSD.1993.297131
Filename :
297131
Link To Document :
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