DocumentCode
189576
Title
Embedded wire diagnosis sensor for intermittent fault location
Author
Incarbone, Luca ; Auzanneau, Fabrice ; Ben Hassen, Wafa ; Bonhomme, Yannick
Author_Institution
Lab. de Fiabilisation des Syst. Embarques, CEA, Gif-sur-Yvette, France
fYear
2014
fDate
2-5 Nov. 2014
Firstpage
562
Lastpage
565
Abstract
This paper presents an EMC (Electromagnetic Compatibility) compliant sensor able to detect and locate intermittent faults longer than 300 μs in wires in real time. The proposed System On Chip can diagnose any wire using different reflectometry-based methods. The injected signal´s spectrum is designed to ensure a continuous harmless diagnosis. The ASIC integrates the whole processing chain, i.e. the analog cells, in particular ADC/DAC, and the digital processing elements based on a custom processing unit (DSP-like) that analyzes in real time the reflected signal. An integrated oversampling system increases the ADC performance more than 20 times, enhancing the location accuracy down to 3 cm. The ASIC was realized in 130 nm TSMC technology and has a surface of 3 mm2. This paper presents intermittent fault detection and location results in a real network.
Keywords
analogue-digital conversion; application specific integrated circuits; cable testing; digital-analogue conversion; electric sensing devices; electromagnetic compatibility; fault location; reflectometry; system-on-chip; wires (electric); ADC; ASIC; DAC; EMC; analog cells; analog-digital converter; custom processing unit; digital processing element; digital-analog converter; electromagnetic compatibility compliant sensor; embedded wire diagnosis sensor; intermittent fault detection; intermittent fault location; reflectometry based methods; size 130 nm; system-on-chip; Application specific integrated circuits; Circuit faults; Electromagnetic compatibility; Fault detection; Fault location; Reflectometry; Wires; ASIC; Diagnosis; MCTDR; OMTDR; Reflectometry; Wire; intermittent fault;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2014 IEEE
Conference_Location
Valencia
Type
conf
DOI
10.1109/ICSENS.2014.6985060
Filename
6985060
Link To Document