DocumentCode :
1896176
Title :
New experimental approach for failure prediction in electronics: topography and deformation measurement complemented with acoustic microscopy
Author :
Richard, Isaline ; Fayolle, Romain ; Smyth, Adrian ; Lecomte, Jean-Claude
Author_Institution :
INSIDIX, Seyssins, France
fYear :
2005
fDate :
18-20 April 2005
Firstpage :
305
Lastpage :
310
Abstract :
Topography and deformation measurements (T.D.M.) under thermomechanical solicitation is a new approach for localising and quantifying deformation of electronic assemblies. Cooling and heating capabilities, with different temperature rate and maximum, following JEDEC thermal profiles for example, have been applied on different components before and after assembly using real time topography and deformation measurements. The interest in being able to perform z and (x, y) deformation measurements for traction/compression and shear stress evaluation will be shown. Using acoustic microscopy before and after thermal stress gives the possibility to detect both the conditions in which elastic limits may have exceeded at interfaces, which interface is concerned and the speed at which delamination occurs. Complementarities of this new technique with acoustic microscopy and simulation will be shown for failure prediction applications.
Keywords :
acoustic microscopy; assembling; deformation; delamination; electronics packaging; failure analysis; stress analysis; surface topography; JEDEC thermal profile; acoustic microscopy; compression; cooling; deformation measurement; delamination; elastic limit; electronic assemblies; electronics; failure prediction; heating; real time measurement; shear stress evaluation; thermomechanical solicitation; topography measurement; traction; Acoustic measurements; Assembly; Electron microscopy; Electronics cooling; Heating; Performance evaluation; Surfaces; Temperature; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
Type :
conf
DOI :
10.1109/ESIME.2005.1502818
Filename :
1502818
Link To Document :
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