• DocumentCode
    1896309
  • Title

    Comparison of silicon and silicon carbide semiconductors for a 10 kV switching application

  • Author

    Johnson, C. Mark

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Sheffield, UK
  • Volume
    1
  • fYear
    2004
  • fDate
    20-25 June 2004
  • Firstpage
    572
  • Abstract
    A simulation-based study is presented which compares silicon (Si) and silicon carbide (SiC) based solutions for a 10 kV switch, operating at frequencies of between 200 Hz and 2kHz in a hard-switched converter. Simplified device models, based on the ambipolar diffusion equation, are developed which allow comparison of p-i-n diodes and various IGBT structures in both Si and SiC. Optimised device parameters are determined which maximise the current carrying capability, subject to thermal dissipation limits, under specified switching conditions. A range of single switch and series switch combinations are examined and comparisons of electrical performance, cost and reliability made. The results show that the total losses for a 10 kV SiC switch and diode are just 17% of those of the equivalent Si devices. Furthermore, the SiC solution is shown to be cheaper, even after allowing for higher perunit area device costs. Although significant performance advantages can be obtained by utilising series combinations of Si devices, a single-device all-SiC solution displays just 36% of the total losses of a 4-device series connected Si solution when switched at 2 kHz. A study of interim solutions, employing Si switches and SiC diodes, shows that a series combination of 2.5 kV trench-IGBT devices and SiC p-i-n diodes offers the most cost-effective route to a high-performance 10 kV, 500 Hz switch.
  • Keywords
    carbon compounds; cooling; insulated gate bipolar transistors; optimisation; p-i-n diodes; power semiconductor switches; semiconductor device reliability; silicon compounds; switching convertors; 10 kV; 2 kHz; 2.5 kV; 200 Hz to 2 kHz; 500 Hz; SiC; SiC diodes; ambipolar diffusion equation; optimised device parameters; p-i-n diodes; reliability; silicon carbide semiconductors; switched converter; switching application; thermal dissipation; trench-IGBT devices; Costs; Equations; Frequency conversion; Insulated gate bipolar transistors; P-i-n diodes; Performance loss; Semiconductor diodes; Silicon carbide; Switches; Switching converters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-8399-0
  • Type

    conf

  • DOI
    10.1109/PESC.2004.1355811
  • Filename
    1355811