Title :
Thermal and structural characterization of polyaniline-dbsa complexation without auxiliary solvents
Author :
Levon, K. ; Zheng, W.-Y. ; Laakso, J. ; Taka, T. ; Osterholm, J.-E.
Author_Institution :
Polytechnic University
Abstract :
Summary form only given. An essential requirement towards solid state extrusion of conducting materials with insulatbig matrices is the absence of auxiliary solvents in the process. We have investigated the complex formation between polyaniline and dodecylbenzenesulphonic acid (DBSA) without any additional solvent. The heat of complexation was followed with calorimetric studies now for the first time for the doping of conducting polymers because, due to the strong self-associating forces mid limited diffusion of DBSA, the complexation occurs only at elevated temperatures and can be measured on a heating scan with a calorimeter. From the measurements we can conclude that the complexation occurs in a stoichiometric ratio of 1:2.5 (wt ratio) with an exothermic heat value of 125 J/g. The alkyl chains, which are attached through the complexation of the alkylated dopant, have a similar effect on the properties of the polymer as earlier has been found with alkylated polythiophenes in which the covalently attached chains act as bound solvents. The complex is soluble in organic solvents and due to the lubrication effect also processable in melt state. The complex forms stratified structures with highly anisotropic layering. The separation of the polymer backbones in a layer by the interdigitating alkyl substituents is measured by the low angle diffraction peak in an X-ray diffractogram.
Keywords :
Chemistry; Conducting materials; Doping; Insulation; Polymers; Research and development; Solid state circuits; Solvents; Temperature; X-ray diffraction;
Conference_Titel :
Science and Technology of Synthetic Metals, 1994. ICSM '94. International Conference on
Conference_Location :
Seoul, Korea
DOI :
10.1109/STSM.1994.835387