DocumentCode
1896744
Title
Comparison of lifetime predictions with 3D finite element model of power electronics devices
Author
Moreau, S. ; Leroy, R. ; Lequeu, T. ; Jérisian, R.
Author_Institution
Univ. F. Rabelais de Tours, Tours cedex 2, France
fYear
2005
fDate
18-20 April 2005
Firstpage
430
Lastpage
435
Abstract
Reliability tests and simulated results on medium power components are discussed in this paper. This study is based on statistical data coming from thermal cycling tests (TCT, air-air test) and thermal shock tests (TST, liquid-liquid test), which are correlated with information coming from failure analysis and compared to results issued from 3D finite element (FE) analysis.
Keywords
failure analysis; finite element analysis; life testing; power semiconductor devices; semiconductor device reliability; thermal stress cracking; 3D finite element model; failure analysis; lifetime predictions; power electronics devices; reliability test; thermal cycling tests; thermal shock tests; Electric resistance; Electric shock; Electronic equipment testing; Electronic packaging thermal management; Finite element methods; Life testing; Power electronics; Predictive models; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502844
Filename
1502844
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