Title :
An initial placement algorithm for 3-D VLSI
Author :
Ohmura, Michiroh
Author_Institution :
Dept. of Electr. Eng., Hiroshima Inst. of Technol., Japan
fDate :
31 May-3 Jun 1998
Abstract :
As manufacturing technology has advanced in recent years, a 3-D IC in which circuits are piled on top of each other has been the focus of attention in the device area. However no initial placement technique has been researched in the layout design of 3-D VLSI. In this paper, we propose a 3-D initial placement algorithm which places strongly connected modules close to each other including adjacent layers by introducing the gains for modules. This algorithm also takes account of layer assignment by multiplying a constant k by the distance in the direction of Z
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; modules; 3D VLSI; adjacent layers; initial placement algorithm; layer assignment; layout design; strongly connected modules; Algorithm design and analysis; Costs; Design methodology; Design optimization; Manufacturing; Routing; Three-dimensional integrated circuits; Very large scale integration; Wire;
Conference_Titel :
Circuits and Systems, 1998. ISCAS '98. Proceedings of the 1998 IEEE International Symposium on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-4455-3
DOI :
10.1109/ISCAS.1998.705245
