Influence of chemo-rheological properties of silica-filled liquid epoxy resins on partial discharge behavior of coils

Author

Kaindl, Arthur ; Schoen, Lothar ; Borsi, Hossein

Author_Institution

Siemens Med. Solutions, Erlangen, Germany

fYear

2001

fDate

2001

Firstpage

551

Lastpage

555

Abstract

This paper describes the investigation of chemo-rheological properties of silica-filled liquid epoxy resins and its correlation to electrical properties of solid insulation, such as the partial discharge behavior of epoxy resin coils. Results of this investigation show that low viscosity is absolutely essential for a good impregnation of insulation layers. High maximum viscosity values, high surface energy of the resin part as well as filler morphology cause poor impregnation behavior. Optimum partial discharge properties may only be obtained if full impregnation within the insulation layer is achieved. As soon as one single void is left in the insulation, the partial discharge inception voltage drops by a factor of 10. Partial discharge data from the epoxy-resin impregnated coil show a significant improvement upon applying epoxy systems with excellent impregnation characteristics

Keywords

coils; epoxy insulation; insulation testing; partial discharge measurement; polymers; transformer insulation; transformer testing; transformer windings; chemo-rheological properties; coil partial discharge behavior; filler morphology; impregnation behavior; maximum viscosity values; partial discharge inception voltage; silica-filled liquid epoxy resins; surface energy; transformer windings; viscosity; Coils; Dielectric liquids; Dielectrics and electrical insulation; Epoxy resins; Partial discharges; Solids; Surface discharges; Surface morphology; Viscosity; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 2001. Proceedings

Conference_Location

Cincinnati, OH

ISSN

0362-2479

Print_ISBN

0-7803-7180-1

Type

conf

DOI

10.1109/EEIC.2001.965757

Filename

965757