Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

Author

Matin, M.A. ; Coenen, E.W.C. ; Vellinga, W.P. ; Geers, M.G.D.

Author_Institution

Dept. of Mech. Eng., Eindhoven Univ. of Technol., Netherlands

fYear

2005

fDate

18-20 April 2005

Firstpage

497

Lastpage

501

Abstract

Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Keywords

fatigue testing; finite element analysis; grain boundaries; microscopy; reliability; solders; thermal stress cracking; thermal stresses; tin alloys; 293 to 353 K; SnAgCu; cyclic thermal loading; fatigue damage; finite element modelling; grain boundary; intrinsic thermal fatigue; orientation imaging microscopy; solder alloy; thermal anisotropy; Anisotropic magnetoresistance; Fatigue; Grain boundaries; Microscopy; Temperature distribution; Thermal engineering; Thermal expansion; Thermal loading; Thermal stresses; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502855

Filename

1502855