DocumentCode :
1897160
Title :
Robust encapsulation of hybrid devices
Author :
Emerson, J.A. ; Sparapany, J.J. ; Martin, A.R. ; Bonneau, M.R. ; Burkhart, D.A.
Author_Institution :
AT&T Bell Lab., Princeton, NJ, USA
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
600
Abstract :
An option for polymeric protection of bare ICs mounted directly to the surface of an alumina substrate is described. This robust package, with enhanced temperature-cycling performance and increased circuit survival rate under actual operating conditions, provides excellent protection throughout processing, handling, and field operation. The enhanced performance is the result of the high modulus and toughness of epoxy selective encapsulant-glob top. A combination of several physical enhancements in the material results from: (1) a higher silica filler content to lower the TCE (thermal coefficient of expansion) of the material, (2) the addition of elastomeric modifiers to improve the fracture toughness and dissipate stress, and (3) the definition of a cure schedule to optimize physical properties. The result of these factors is a good material formulation coupled with an enhanced cure schedule to yield a low-stress hybrid package. The final internal material stress, 3.2 MPa, is determined by the uniformly loaded beam method. The lower stress and lower TCE provide a four-fold improvement of temperature-cycling performance over older epoxy materials
Keywords :
encapsulation; hybrid integrated circuits; packaging; TCE; circuit survival rate; cure schedule; encapsulation; epoxy selective encapsulant; fracture toughness; glob top; internal material stress; low-stress hybrid package; modulus; operating conditions; polymeric protection; robust package; silica filler content; temperature-cycling performance; toughness; uniformly loaded beam method; Circuits; Encapsulation; Internal stresses; Packaging; Polymers; Protection; Robustness; Silicon compounds; Thermal expansion; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122249
Filename :
122249
Link To Document :
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